BGA adapters introduction:
The BGA (Ball Grid Array) is a type of microchip package.
BGA package use a group of solder dots, or balls, arranged
in concentric rectangles to connect to a circuit board. Some
pictures by way of illustration:
The BGA packages of different manufacturers of chips differs
in all possible parameters - body size, ball matrix,
lead-to-lead spacing (leads pitch), package thickness, ball
alignment (perimeter, full array, part of array inside,
etc.), ball height and diameter, ... . The variety of BGA
packages is really huge, but it is not end of troubles. At
the same package type, the different manufacturers use
different signal alignment. Result of this situation is
enormous number of necessary BGA adapters.
In generally, the BGA adapter consist of two board. The
top board carry the BGA ZIF socket, that accept a certain
BGA package dimension chips (for example 8x8 ball array,
11x8mm body size). The bottom board provide a proper
interconnection from top board to the 48 pins, going to the
ZIF socket of the programmer. The top board of the BGA
adapter is most expensive part of the BGA converter because
of ZIF BGA socket price.
To offer you most effective solution of BGA adapter,
we've decided to split the BGA adapter to BGA-Top and
BGA-Bottom boards and offer them also separately. Result is
that you don't need to buy more BGA adapter to program the
chips in the same BGA package - you only have to use a
different BGA-Bottom boards. We also come to conclusion to
use the on-demand developed BGA sockets, which are
insensitive to ball diameter and package thickness. This
sockets also have a extreme mechanical lifetime - 500 000
actuations(!). In the case of too big tolerances of ZIF
package dimensions manufacturing and in some special cases,
there are used standard - 10 000 actuations - BGA ZIF
sockets.
For example, if you want to program the W19B322MB in
TFBGA48 and Am41DL1614DT in FBGA69 you have to order only
one BGA-Top-3 ZIF-CS board and two bottom boards
(BGA-Bottom-1 and BGA-Bottom-2). Another words you save - in
the case of Elnec solution - more then 70% of complete BGA
adapter price.
As you can see, the Elnec BGA package
adapter is combination of different BGA-Top and BGA-Bottom
board. Therefore the name and also the ordering number of
the BGA adapter is also combination of ordering number of
the BGA-Top and BGA-Bottom board.
BGA adapter identification:
BGA-BBBB/TTTT (ord.no. 70-BBBB/TTTT)
- BBBB- last 4 digits of
respective BGA-Bottom board ordering number
- TTTT- last 4 digits of
respective BGA-Top board ordering number
Example: the adapter BGA-0245/0243 (ord.no. 70-0245/0243)
comprise of BGA-Bottom-1 board (ord.no. 70-0245) and
BGA-Top-3 ZIF-CS board (ord.no. 70-0243)
